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AI & GPU servers / NVIDIA H200
HOPPER / HGX & NVL

NVIDIA H200.
Built around bandwidth.

Complete H200 systems for memory-intensive AI and HPC. Specify HGX SXM with NVSwitch or a PCIe NVL platform with supported bridge groups.

141 GBHBM3e per GPU
4.8 TB/sMemory bandwidth / GPU
1,128 GBAggregate in 8 GPUs
8UHGX reference chassis
CONFIGURATION BRIEF

The full system, defined.

The HGX configuration references Supermicro’s SYS-821GE-TNHR, an 8U dual-Xeon system supporting eight H200 SXM GPUs. H200 NVL is a separate PCIe option; the builder uses the Supermicro SYS-422GL-NR 4U PCIe platform with a different interconnect design.

HGX reference platformSupermicro SYS-821GE-TNHR, 8U, supporting HGX H100 / H200. The NexTec proposal specifies H200 SXM.
GPU baseboard8× H200 SXM with 141 GB HBM3e each; 1,128 GB aggregate. Up to 4.8 TB/s local memory bandwidth and 900 GB/s NVLink per GPU.
GPU fabricHGX eight-GPU designs use NVLink and four NVSwitch devices. GPU fabric and external scale-out network are separate parts of the architecture.
Host computeDual 4th / 5th Gen Intel Xeon Scalable. CPU models, core count, TDP, and firmware are selected against the supported OEM list.
ECC memory32 DDR5 DIMM slots; up to 8 TB platform capacity. Actual speed depends on CPU, DIMM type and DIMMs per channel.
Boot / storage2× M.2 NVMe for boot. Up to 16 hot-swap 2.5-inch NVMe bays: 12 default, 4 optional; SATA configuration also available.
Fabric expansionEight PCIe 5.0 x16 low-profile slots, plus two FHHL slots and two optional FHHL slots. Select NIC count, GPU affinity, fabric, optics, and cabling as a complete design.
Power / facilityH200 SXM up to 700 W each: 5.6 kW across eight GPUs before the host and other components. Complete feed, PSU, cooling and rack requirements are confirmed for the ordered build.
NVL alternativeH200 NVL: 141 GB HBM3e, up to 600 W, PCIe 5.0 x16. Supported 2- or 4-GPU NVLink bridge groups; it is not the HGX eight-way switched fabric.
System acceptanceGPU and fabric health, PCIe/NVLink enumeration, memory and storage checks, sustained power/thermal behavior, representative training or inference, and documented firmware/software versions.

SXM modules are HGX platform components, not standard PCIe add-in cards. NVL and SXM cannot be substituted in the same baseboard.

A chassis reference photo does not prove the installed GPU model. The gallery separately identifies the official HGX H200 baseboard.

CONFIGURE A REQUIREMENTS BRIEF

More choice. The right platform.

Choose a reference platform first. Its CPU, memory population, GPU topology and storage envelope stay together. Your selections become an itemized inquiry, not a checkout.

Inquiry only · no price or stock commitment

Published platform limits are not approval of every combination. NexTec reviews the exact bill of materials, OEM qualification, cooling, power and availability before quoting.

01 · Platform & compute
Reference server platform
Host processorsMatched two-processor preferences within the platform socket/TDP envelope. Exact CPU and BIOS qualification remains mandatory.
Requested GPU populationThis reference build has a fixed eight-GPU population.
GPU interconnect

Fixed eight-GPU HGX baseboard with NVLink/NVSwitch. SXM modules are not PCIe NVL cards.

GPU power planning

Up to 700 W per GPU from the manufacturer specification. This envelope is not actual wall power.

HGX reference: dual Xeon Scalable, 32 memory slots, fixed eight H200 SXM GPUs, dual M.2 boot slots and 12 default NVMe bays. Optional extra bays are not silently included.

02 · Memory & storage
System memory14 documented population preferences, plus custom review. 1DPC = one DIMM per memory channel; 2DPC = two. Matched density, rank, type and OEM-qualified part numbers are required.
Boot storageBoot and data drives are separate. Mirror support and exact drive qualification are checked with the OS and platform.
NVMe data drive quantityUses only the default 12-bay envelope. Optional backplanes, controllers or extra bays require a separate review.
Requested capacity per data driveCapacity target, not a drive SKU or availability claim. Form factor, firmware, endurance and OEM qualification are mandatory.
Data layout
03 · Fabric & deployment
Application networkNIC count, GPU affinity, optics, cables, switches and PCIe slot budget are quoted as one design. Port speeds are requirements, not included hardware.
Management / onboard network

Dedicated management; optional 10/25GbE and GPU-affiliated NICs specified separately

Rack delivery
Power and cooling review
Power & thermal boundary

6× 3000 W, 4+2 design; 2880 W/module at 200–207 VAC and 3000 W at 207–240 VAC. Optional PSU changes require a separate BOM.

HGX cooling implementation must match the qualified GPU/baseboard BOM. Confirm air/liquid requirements, facility infrastructure, load, rack clearance and required onsite service.

04 · Software, validation & support
Operating system
Software preparation
Validation scope
Support requirements

Photos and 3D views illustrate the named reference platform and do not change with these selections. No alternative chassis or GPU geometry is implied.

LET’S BUILD WHAT’S NEXT

Your workload. Our starting point.

Tell us what you’re building. We’ll help scope the infrastructure.

Request a quote