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AI & GPU servers / RTX PRO 6000 Blackwell
FLAGSHIP / 8-GPU BLACKWELL

8× RTX PRO 6000.
The complete AI server.

Eight NVIDIA RTX PRO 6000 Blackwell Server Edition accelerators, dual Xeon host compute, ECC memory, enterprise NVMe, and high-speed networking in a configurable 5U platform.

8× 96 GBRTX PRO Server Edition
768 GBAggregate GPU memory
5URackmount chassis
PCIe 5.0Switch dual-root topology
INTERACTIVE SYSTEM ARCHITECTURE

Explore the system in 3D.

Rotate the chassis, separate its layers, and select a component to understand its role.

8-GPU / 5U REFERENCE

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Reference: Supermicro SYS-521GE-TNRT. Chassis envelope: 438 × 222.5 × 786.1 mm. Component placement, clearances, connectors and cable routing are simplified; this is a detailed reference model, not OEM CAD or an assembly guide. The proposed GPU count is eight. Final BOM, DIMM population and power redundancy require platform validation.

CONFIGURATION BRIEF

The full system, defined.

NexTec’s proposed 8-GPU build uses the Supermicro SYS-521GE-TNRT as its reference platform. The table identifies the OEM hardware envelope; the configuration builder below records your requested bill of materials. Exact part numbers, firmware, power limits, and acceptance testing are confirmed in the written proposal.

Reference systemSupermicro SYS-521GE-TNRT · CSE-528GTS-R5K40P chassis · X13DEG-OA motherboard.
Specified GPUs8× NVIDIA RTX PRO 6000 Blackwell Server Edition, passive air-cooled; 96 GB GDDR7 ECC each.
GPU compute / memory24,064 CUDA cores; 188 fourth-generation RT cores; 1,597 GB/s memory bandwidth per GPU. 768 GB aggregate memory across eight devices.
GPU compatibilityCurrent OEM matrix: up to 8 double-width GPUs. GPU type, power profile, risers, and harnesses must match the qualified configuration.
Host processorsTwo LGA-4677 sockets. 4th / 5th Gen Intel Xeon Scalable; up to 64 cores and 350 W per CPU with air cooling.
CPU starting options2× Xeon Gold 6530: 64 total cores, 270 W TDP each; or 2× Xeon Platinum 8592+: 128 total cores, 350 W TDP each. Final BOM subject to OEM qualification.
ECC system memory32 DDR5 DIMM slots. OEM maximum: 4 TB at 1 DIMM/channel, up to 5600 MT/s; 8 TB at 2 DIMMs/channel, up to 4400 MT/s. CPU and DIMM selection set actual speed.
Balanced memory populationChoose documented balanced 1DPC or 2DPC populations in the builder. 5th-generation CPU preferences only; 24 GB and 48 GB DIMMs are excluded at 2DPC. CPU limits, matched rank/type and qualified DIMM SKUs set actual speed.
Boot devices2× M.2 NVMe slots. Proposal options include paired enterprise boot drives; mirroring method and OS support are itemized.
Front storageDefault: 8× 2.5-inch NVMe and 8× 2.5-inch SATA hot-swap bays. An optional additional 8-bay NVMe configuration requires the appropriate controller and cabling.
Expansion / topology13 PCIe 5.0 x16 FHFL slots; switch-based dual-root architecture. Slot link width is distinct from aggregate switch-uplink bandwidth.
Network / managementOnboard 2× 10GbE RJ45 via Intel X710-AT2; dedicated IPMI management. AIOM/OCP 3.0 and PCIe NIC options for the application fabric.
High-speed fabricQuote 100/200/400GbE or InfiniBand with qualified NICs, optics, cables, and switch ports. Define GPU/NIC locality, storage traffic, and GPUDirect requirements.
CoolingUp to 10 heavy-duty fans with speed control and an air shroud. Passive GPUs rely on chassis airflow. Rack inlet temperature and GPU power settings must follow OEM limits.
Power hardware4× 2700 W Titanium PSUs; 200–240 VAC input. A 2+2 arrangement provides 5.4 kW nominal surviving output after loss of two modules; the complete DC load must fit that envelope.
GPU power budget400–600 W configurable per GPU: 3.2–4.8 kW for eight GPUs alone. The suggested 450 W planning profile leaves more headroom; exact supported settings and failover require validation.
Rack envelope5U · 438 mm wide × 222.5 mm high × 786.1 mm deep. Confirm installed weight, rails, cable clearance, PDU connectors, and front-to-rear airflow.
Integration deliverablesExact BOM and serial inventory; firmware/driver versions; GPU, ECC, storage and network results; sustained thermal/power logs; workload acceptance results; and the agreed support path.

This is a proposed configuration based on published OEM specifications, not an already benchmarked or in-stock NexTec SKU.

Aggregate GPU memory is not one unified memory pool. RTX PRO 6000 provides no HGX NVLink/NVSwitch fabric; validate PCIe peer access for the selected firmware and software stack.

OEM gallery photos show reference populations and older callouts. The written BOM and current support matrix determine the eight-GPU configuration.

CONFIGURE A REQUIREMENTS BRIEF

More choice. The right platform.

Choose a reference platform first. Its CPU, memory population, GPU topology and storage envelope stay together. Your selections become an itemized inquiry, not a checkout.

Inquiry only · no price or stock commitment

Published platform limits are not approval of every combination. NexTec reviews the exact bill of materials, OEM qualification, cooling, power and availability before quoting.

01 · Platform & compute
Reference server platform
Host processorsMatched two-processor preferences within the platform socket/TDP envelope. Exact CPU and BIOS qualification remains mandatory.
Requested GPU populationThis reference build has a fixed eight-GPU population.
GPU interconnect

PCIe 5.0 switch dual-root; no NVLink/NVSwitch GPU fabric on RTX PRO 6000

Requested GPU power capA requested cap, not an approved operating profile. Full system and failover validation is still required.

Intel reference: dual Xeon Scalable, 32 memory slots and dual onboard M.2 slots. Default 8 NVMe data bays; optional extra bays need a separate BOM.

02 · Memory & storage
System memory14 documented population preferences, plus custom review. 1DPC = one DIMM per memory channel; 2DPC = two. Matched density, rank, type and OEM-qualified part numbers are required.
Boot storageBoot and data drives are separate. Mirror support and exact drive qualification are checked with the OS and platform.
NVMe data drive quantityUses only the default 8-bay envelope. Optional backplanes, controllers or extra bays require a separate review.
Requested capacity per data driveCapacity target, not a drive SKU or availability claim. Form factor, firmware, endurance and OEM qualification are mandatory.
Data layout
03 · Fabric & deployment
Application networkNIC count, GPU affinity, optics, cables, switches and PCIe slot budget are quoted as one design. Port speeds are requirements, not included hardware.
Management / onboard network

2× 10GbE RJ45 plus dedicated IPMI

Rack delivery
Power and cooling review
Power & thermal boundary

4× 2700 W, 200–240 VAC; 2+2 nominal surviving output 5.4 kW, subject to complete-load validation

Passive GPUs, forced chassis airflow. One eight-GPU RTX qualification row is limited to 20°C ambient; exact GPU power/CPU/ambient BOM qualification is required, not a blanket chassis rating.

04 · Software, validation & support
Operating system
Software preparation
Validation scope
Support requirements

Photos and 3D views illustrate the named reference platform and do not change with these selections. No alternative chassis or GPU geometry is implied.

LET’S BUILD WHAT’S NEXT

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